A motherboard or mainboard (source: Ming-Chi Kuo)
The iPhone 17 range may not utilize the rumored thinner motherboard after all. It would have reduced costs and also increased available space for other components.
At the time, Kuo said that this would not only save internal space in the iPhone 17 but “because it’s fiberglass-free” would also make the required drilling easier. That in itself would cut down on production costs.
Now, however, Kuo says that Apple has dropped the plan to use it in the 2025 range. The change is due “to the inability to meet Apple’s high-quality requirements,” he said in a tweet.
In his original report, Kuo did say that RCC would not be used in the iPhone 16 range because of “its fragile characteristics and inability to pass drop tests.” Presumably, Apple was confident in overcoming these issues, but presumably, it failed to do so.
