Arm Unveils 2024 CPU Core Designs, Cortex X925, A725 and A520: Arm v9.2 Redefined For 3nm

As the semiconductor industry continues to evolve, Arm stands at the forefront of innovation for its core and IP architecture, especially in the mobile space, by pushing the boundaries of technology to deliver cutting-edge solutions for end users. For 2024, Arm's year-on-year strategic advancements focus on enhancing last year's Armv9.2 architecture with a new twist. Arm has…

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French publishers ask Tim Cook to abandon forthcoming Web Eraser

Safari getting new AI tools in iOS 18 Advertisers and publishers in France have jointly written to Tim Cook imploring Apple to not roll out the ability for Safari users to selectively erase portions of sites, such as ads. Apple has not even announced the forthcoming Web Eraser — exclusively uncovered by AppleInsider — but…

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Lexar ARMOR 700 Portable SSD Review: Power-Efficient 2 GBps in an IP66 Package

Lexar has a long history of serving the flash-based consumer storage market in the form of SSDs, memory cards, and USB flash drives. After having started out as a Micron brand, the company was acquired in 2017 by Longsys which has diversified its product lineup with regular introduction of new products. Recently, the company announced…

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TSMC: Performance and Yields of 2nm on Track, Mass Production To Start In 2025

In addition to revealing its roadmap and plans concerning its current leading-edge process technologies, TSMC also shared progress of its N2 node as part of its Symposiums 2024. The company's first 2nm-class fabrication node, and predominantly featuring gate-all-around transistors, according to TSMC N2 has almost achieved its target performance and yield goals, which places it…

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GEEKOM A7 mini-PC Review : Premium Phoenix in a Compact 4×4 Package

The introduction of the Intel NUC in the early 2010s kickstarted the ultra-compact form-factor (UCFF) trend for desktop systems. Processors with TDPs ranging from 6 - 15W formed the backbone of this segment in the initial years. The emergence of configurable TDPs for notebook processors has prompted some vendors to introduce UCFF systems with regular…

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TSMC’s 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027

TSMC's 3D-stacked system-on-integrated chips (SoIC) advanced packaging technologies is set to evolve rapidly. In a presentation at the company's recent technology symposium, TSMC outlined a roadmap that will take the technology from a current bump pitch of 9μm all the way down to a 3μm pitch by 2027, stacking together combinations of A16 and N2…

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